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Linkra will give a lecture at this conference dedicated to optoelectronic packaging. Currently Optoelectronic packaging  is one of the main challenges for optoelectronic device and optoelectronic integration. Among others, it comprises optical underfill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To overcome these challenges, a wide range of analysis and expertise for integrated optoelectronics, thermal and power management should be done.
For more information see: http://uk.imapseurope.org/index.php/event-main/events-jem/event/14