Linkra supports customers in  product development thanks to an Integrated technology platform (automated chip&wire and optical alignment  technologies) for the development and manufacturing of Microwave and Optical components and modules for Defense, and Telecom markets.

Microwave technology

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  • Circuital Simulation and Design Tools (AWR Microwave, Waspnet)
  • Electromagnetic simulation (CST Design Studio, HFSS Ansys)
  • CAD tools (DxDesigner/Mentor, ProEngineer)
  • Instrumentation and test environments (Vector Network Analyzer, Climate chamber…)

Photonics technology

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  • Development of photonic components and modules
  • Thermal analysis and thermal management of packaged photonics modules
  • Mechanical design and structural analysis of photonics components and modules
  • Front end (in package) and back end electronics development and production
  • Optical and electric qualification test benches

Microwave Photonics technology

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  • Optical Link modules: building blocks for Optical Link systems and sold as stand-alone modules (customer’s proprietary communication platforms) for Military and SATCOM applications. Products: Transmitters, Receivers and Transceivers
  • Optical Link systems: custom or semi-custom applications for the transmission of RF/MW signals over fiber optic cabling for end-users or OEMs markets. Market segments: Electronic Warfare (EW), MILSATCOM, GPS Navigation & Timing, Terrestrial RF Communications

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Microtech is a provider of manufacturing services for microwave optical and photonic modules either on a build to print or build to spec approach.

This activity includes:

  • Prototyping and Preseries,
  • Components and Modules assembly and testing,
  • Packaging service,
  • System integration.

Microtech assembly and testing operations are made in a 1,825 sqm clean room:

  • Thick film (ceramic substrate) production capacity of 150 sqm,
  • Manufacturing lines that include fully automatic processes for adhesive and solder paste dispensing,
  • Components placement process (SMD and MMICs),
  • Connection equipment (wire and ribbon bonding).