Multi Project Packaging runs (MPPr’s), October 2016 – January 2017

Multi Project Packaging runs (MPPr’s), October 2016 – January 2017
In order to make prototyping of integrated photonics more cost efficient Linkra announce Multi Project Packaging runs (MPPr’s) per October 2016 and January 2017: the MPPr call is just opened. Linkra will further decrease prices and lead time and increase the packaging options and the frequency of MPPr’s. Use the link here below to find out more, the latest schedule, participation instructions, Te...
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Photonics & Opto-Electronics Packaging Conference, Edinburgh, Scotland; November 22-23.

Photonics & Opto-Electronics Packaging Conference, Edinburgh, Scotland; November 22-23.
Linkra will give a lecture at this conference dedicated to optoelectronic packaging. Currently Optoelectronic packaging  is one of the main challenges for optoelectronic device and optoelectronic integration. Among others, it comprises optical underfill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectr...
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Micro Photonics International Congress Expo

Micro Photonics International Congress Expo
Linkra Srl shall be present at the Micro Photonics International Congress Expo in Berlin the 11-13 October 2016 as relator. The TUESDAY 11 OCTOBER 2016 at 13:30-15:00 the Linkra’s Photonics CTO shall have a windows to present the result on “Photonic Processing of Wideband High Linearity Microwave Signals”. Please see here the Event Flyer
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Linkra starts Multi Project Packaging runs (MPPr’s)

Linkra starts Multi Project Packaging runs (MPPr’s)
In order to make prototyping of integrated photonics more cost efficient Linkra starts organizes regular Multi Project Packaging runs (MPPr’s) per July 2016: thus the first MPPr call just opened. As experience grows, Linkra will further decrease prices and lead time and increase the packaging options and the frequency of MPPr’s. Use the link here below to find out more, the latest schedule, parti...
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Linkra and TeCIP INPHOTEC, Benefit from the cooperation

Linkra and TeCIP INPHOTEC, Benefit from the cooperation
The recently signed biannual cooperation agreement between Linkra and TeCIP INPHOTEC gives access to new R&D, engineering and production features to the photonics supply chain. Core of the agreement is applying the combined advanced industrial assets, capabilities and processes in designing and manufacturing of competitive Photonic packaging services. This ranges from the development, proto...
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