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 Assembling Capabilities
Automatic fiber alignment and fixing systems
- nanometric resolution
- Up to 16 to motorized axes
- Laser welding / UV Epoxy Glue
Solder paste and glue dispensing, 3 automatic machines
- volumetric dispensing, two pumps, 1
- 2mm deep access,
- PRS,
- accuracy +/- 25mm @ 3 s,
- height laser measurement (no contact),
- no limitation in materials and patterns
Component placement (SMD and Chip&Wire), 3 automatic machines
- GaAs MMIC with air bridges
- placement accuracy +/- 12mm @ 3 s
- 12mm deep access
- PRS
- Placement force programmable
- Automatic pick-up changer
- Up-looking camera (flip chip)
- Up to 40 waffle/gel packs stations (2”x2”)
- Up to 25 tracks, 8mm tapes
High speed component placement (SMD), one automatic machine
- Pick&Place Head and 6 nozzle collect & place heads
- Components range from 0.6x0.3 mm2 (0201) to 55x55mm2
- Up to 118 tracks, 8mm tape
- Component bar code scanner
- PRS - Placement accuracy up to +/- 37mm @ 3 s
Eutectic AuSn die attachment, 3 vacuum furnaces
- Vacuum or Nitrogen brazing process
- Moisture level to < 200ppm
- Vacuum grade: 10-2 torr
Belt ovens for solder paste reflow and adhesive curing, 4 convection ovens
- Air or Nitrogen atmosphere
- Two both reflow and curing settings (6+6 zones). Lead free compliance.
- Two for adhesive curing (6+2 zone)
Plasma cleaning, 4 machines
Automatic gold wire (wedge) and ribbon bonding, 7 machines
- Wire diameter: 18-76mm
- Ribbon size: 38 to 305 wide x 12 to 25mm thick
- Up to 250x125mm2 effective working area
- 10 mm deep access
Package sealing
- Laser Welding
- Parallel Seam Welding Hermeticity test
- Leak detector
- Fine leak detector
Pull/Shear test
- Destructive/non destructive pull test up to 100g
- Destructive/non destructive pull test up to 1Kg
- Destructive/non destructive shear test up to 5Kg
- Integrated software for data analysis
Other equipment available
- manual wire/ribbon bonders
- thermocompression machines
- parallel-gap machines
- flip-chip bonder
- static ovens
- –40°C refrigerators
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