R&D Team

Teleoptix R&D team is composed of more than 30 people. Expertise in HF electronic and Optical Design, Packaging, Thermal Management allows R&D team to implement solutions that are ideal for product manufacturing.

Starting from project definition through feasibility, design, prototyping to project release the team operates in order to achieve the best industrial solution.
Technical core competences are available for the design in the following fields:
Optical transceivers (10÷40 Gbps TDM, DWDM).
Optical components (10÷40 Gbps TDM, DWDM).

Redesign for cost reduction on customer specification

Design

The main design tools used are:

• Schematic design and layout generation: MW Office, Mentor Graphics
• High Frequency simulation (linear, non linear, 3D electromagnetic): HFSS, MW Office, Ansoft Designer
• Thermal simulation.
• Ray tracing simulation for micro optical bench: Zemax
• Firmware development
• Layouting: Pro E, Solidworks, AutoCAD

Equipment

• BER measurements 10 ÷40 Gbps
• High bit rate system measurements in different modulation formats (DPSK, DQPSK, Duobinary, NRZ, RZ…)
• E/O S parameters measurements up to 67 GHz
• Optical Active Alignment
• Thermal analysis microscope (thermal mapping): Computerm III
• Scanning Electron Microscope (SEM)
• Scanning Acoustic Microscope (C-SAM).